2026-05-25 15:03:43
Custom 4-Inch Wafer Gold Layer Peeling Machine
Gold Layer Peeling Machine is designed for precise and efficient wafer film and gold layer peeling, featuring stable operation and high processing accuracy for semiconductor applications.
This is a new product recently developed by our company, and both manual and semi-automatic can be customized.
NO
parameter
Name
Crystal stripping machine
Model
DSX-26-049
Size of Wafer
4 inch
Table
4 inch ×6 pcsd,With a groove
Fixed Mode
Material quality
Aluminum Material
Surface preparation
Oxide hardening
Operate mode
Manual
Air pressure
0.6–0.8Mpa
Physical dimension
1010×498×347mm(Length × Width × Height)
location mode
Notch positioning
Heating System
Obligate
Manufacturer
DSXUV/Guang dong Spacelight Electronics Co., Ltd
Vac-sorb
